Intel Dalian is forming a new and advanced engineering team under Technology and Strategy Office (TSO) with focus on significant cost reduction, product enhancement innovations, and equipment & process enablement for future generations of 3D NAND technologies. This job requisition is to seek strong candidates for the positions of process, integration and device engineers.
Scope of work spans over silicon process improvement and product enhancement, equipment capability evaluation and expansion, and manufacturing cost reduction.
--Perform feasibility study and provide module or segment level process solutions to meet desired device specification and process improvement requirements
--Lead new process experimentation, implementation and high volume manufacturing readiness
--Define, select and qualify the equipment platforms to meet quality and output needs of new processes for high volume manufacturing ramp.
-- MS or PhD in a relevant science or engineering field from a prestigious school or research institute;
--Hands-on expertise and achievements in device design and simulation; product or material fabrication and characterization; instrument system setup and improvements；
--Excellent skills of problem solving with creativity and out-of-box thinking;
--Strong skills of data analysis, process characterization, qualification and troubleshooting;
--Semiconductor work experience is highly desired.
--Motivated self-starter, with strong ability to work independently as well as in a team environment;
--Strong verbal and written communication skills in English;
--Think and operate independently, while simultaneously focusing on many diverse priorities;
--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities;
--Commit to aggressive goals and win with a can-do attitude;
--Act with velocity and a strong sense of urgency;
--Respect cultural diversity and sensitivity;
--Agility in learning, improving, and innovatingInside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.