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Job ID: JR0037725
Job Category: Intern/Student
Primary Location: Folsom, CA US
Other Locations:
Job Type: Intern

3D-XPoint Mixed Signal Design Undergraduate Intern

Job Description

An analog designer intern on the 3DXP design team will be responsible for pathfinding new solutions to reduce energy, power, latency, die size of 3DXP products and to develop solutions for new technology requirements. Once all paths have been identified, designers build and test schematics that meet all functionality and performance goals for the designated 3DXP products and develop methodologies and coverage metrics to ensure quality at the fullchip level. After design is complete, designers support fullchip validation by building various path and fullchip models and running extensive full chip validation suites while also working with layout to ensure cell level and block level layout is being drawn as necessary to achieve the desired performance and spec functionality. Finally, the designers work with product engineering to debug post silicon issues by developing models for observed behavior and proposing experiments both in silicon and in simulation to prove or disprove the proposed models.

Typically an intern will do a subset of the mentioned work depending on length of internship.  Most intern work assignments demand a two semesters of intern time.


Qualifications

The candidate must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Candidate must be pursuing a BS Degree in Computer Engineering, Electrical Engineering, Computer Science, or any other related field.
  • Must have the permanent right to work in US without sponsorship
  • 6 months experience or equivalent coursework in the following areas: Semiconductor Device Physics. Analog circuits. Unix/ SPICE.

Preferred Qualifications:

  • Engineering design techniques, tools, and principles involved in production of precision technical plans blueprints, drawings, and models.
  • Programming language such as C++, perl, tcl.
  • Microsoft Office tools

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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