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Job ID: JR0036249
Job Category: Engineering
Primary Location: Kulim, KDH MY
Other Locations:
Job Type: College Grad

Package Failure Analysis Engineer

Job Description

Responsible for identifying and researching component failures to improve product yield, quality and/or reliability. Evaluates the electrical and mechanical characteristics of integrated circuits, components, subcomponents, and systems to determine the root cause of failure. Analyzes failure reports and recommends corrective action to prevent reoccurrence of problems. Uses all standard electronic test equipment digital/analog such as Logic analyzer, ICE, ITPO oscilloscope and test systems to do board failure analysis and debug. May support new product transfer and startup and the automation and improvement of the failure analysis process. Strives to proliferate shared learning across sites. Maintain necessary records and reports. Performs other related duties as required or as directed.


Qualifications

Degree in Material/Chemical/Electrical Engineering

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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