This position is for TRB Process Equip Engineer and it requires strong technical knowledge in Test Program/Thermal/Tester function & TIU debugging and developing auto script for sustaining collaterals purpose. You are expected to take part actively in VF Virtual Factory-Cross-sites activities especially in engineering improvements project and solutions. The role also requires excellent communications skill, improvement of processes and collaterals stability reduce variance, cost reductions projects and meet targets in optimum way. As TRB engineer, you will work closely with other stakeholders and data team to support day to day engineering advanced work: support production's needs, responsibility for highly advanced processes and TIU stability. Successful candidate will lead and participate in continuous improvements projects to TIU, socket and other hardware spare sustaining challenges.
1.At least a Bachelor of Science Degree/Master in Electrical Engineering 2.General knowledge, personal skill, and working experience to be considered as hiring advantage 3.Possess statistical data analysis and data system automation skills 4.Excellent verbal/written communication skills with the ability to effectively communicate with peers, engineering and customers 5.Candidate must be flexible and capable of handling multi-task operations. 6.Ability to work with minimal supervision and adjust to rapidly changing priorities. 7.Must be a self-starter capable of managing own activities as well as supporting team activities. 8.Computer literacy and basic math skills are required. Lean skillsInside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth