Job Description An experienced analog designer on the 3DXP design team will be responsible for pathfinding new solutions to reduce energy, power, latency, die size of 3DXP products and to develop solutions for new technology requirements. Once all paths have been identified, designers build and test schematics that meet all functionality and performance goals for the designated 3DXP products and develop methodologies and coverage metrics to ensure quality at the fullchip level. After design is complete, designers support fullchip validation by building various path and fullchip models and running extensive full chip validation suites while also working with layout to ensure cell level and block level layout is being drawn as necessary to achieve the desired performance and spec functionality. Finally, the designers work with product engineering to debug post silicon issues by developing models for observed behavior and proposing experiments both in silicon and in simulation to prove or disprove the proposed models.
Education:Bachelor's or Master's degree in Electrical Engineering, Computer Engineering or a related disciplineExperience:2 years of experience in analog transistor level circuit developmentFocus Area Skills/Strengths:- Strong academic background required in CMOS semiconductor device physics and silicon processing- Relevant coursework in CMOS digital, analog, and I/O circuit design- Knowledge of transistor-level circuit simulation tools such as SPICEAdditional qualifications include- Familiarity with CMOS transistor and semiconductor device layout methods- Experience using custom design environments such as Cadence Virtuoso- Knowledge of DRC, LVS, and post-layout extraction tools- Proficiency in UNIX and strong programming skills using C++, Perl, TCL, etc.- Project work using device modeling tools such as hsim, Ultrasim, etc
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.