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Job ID: JR0028524
Job Category: Engineering
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: College Grad

Failure analysis R&D engineer

Job Description

Intel leads the semiconductor industry by creating innovative technologies. We have a passion for leading the industry and changing the world. As an Intel TEM (transmission electron microscopy) engineer, you'll join a team helping to characterize next generation microprocessors. Responsible for performing world class transmission electron microscopy analysis or providing microscopy solutions for critical problems in support of process development, pathfinding and failure analysis. Requires use of all TEM-related imaging and analysis techniques and development of novel characterization techniques to characterize the process that is critical to enhance performance, yield and reliability. Work closely with process, yield and equipment engineers for design of experiments and results to identify and solve problems. Work closely with other TEM and analytical lab engineers to discuss experimental results, share knowledge and learning, continuously learn, develop and innovate. Work closely with TEM sample preparation artists to understand and meet requirements and challenges. May support process transfer, tool maintenance and evaluation. Maintains necessary records and reports. Performs other related duties as required or as directed.


Qualifications

You must possess the below minimum qualifications to be considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

Candidate must possess a MS or PhD in materials science, applied physics, chemical engineering, electrical engineering, computer science, or related field.

Preferred Qualifications:

-Experience in programming and simulation of electron microscopy results or data analysis and image processing.
-Experience with the relationship between microstructure and properties of materials.
-Experience with device physics, failure analysis techniques and reliability failure mechanisms.
-Hands on experience in scanning and transmission electron microscopy STEM techniques including high resolution imaging, electron diffraction analysis, EDS and EELS analysis.
-Hands on experience of TEM (transmission electron microscopy) sample preparation techniques including using dual beam FIB lift out technique.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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