Principal Engineer – NVM Thin Films Process Integration
Principal Engineers at Intel are active technical leaders inside and outside the company. A Principal Thin Films Process Integration Engineer in NSG Technology Development is responsible for leading research and development of the next generation 3D NAND or 3DXpoint Non-volatile memory technology thin films processes to support Intel's growing business in storage and memory.
The responsibilities will include:
Leading and managing a direct and matrix reporting group of engineers responsible for developing the thin films process technology roadmap, including process architecture, process capability, process roadmap, tool capability and roadmap and extendibility, silicon experimentation and analysis.
The Principal Engineer is viewed as an expert providing technical direction and leadership in tackling complex cross-functional technology issues, and the engineer will initiate and execute advanced research with significant long-term impact to the business.
You will collaborate with technology development partners in defining goals, developing the vision, aligning strategy, and driving fast paced silicon development to meet aggressive technology node cadences. Ensure tool and process roadmaps are aligned to technology capability requirements.
You will work with the process and integration teams to ensure seamless integration of etch (thin films) as well as with the manufacturing Fabs to ensure a seamless technology transfer and ramp to support the full envelope of component and system products.
The position is based in Boise, ID.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.