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Job ID: JR0020279
Job Category: Contract Employee
Primary Location: Kulim, KDH MY
Other Locations:
Job Type: Experienced Hire

Product Engineer

Job Description
In this position you will be joining the Intel Module Repair IMR group, located in Kulim, Malaysia. The candidate will be responsible for developing safe, quality test solutions for continuous improvement in HDMT/STHI/xPV PCB. he/she will be also responsible for test module sustaining and debug operation to drive for continuous improvement including test output/beat-rate, yield, safety, WIP inventory and test spare management. The person is required to work closely with US test module engineer/lead for any new product repair test collateral enabling. The candidate will be expected to excel in technical writing of repair specifications, training/test procedures and White Papers. Candidate is also responsible for ensuring CE! is adhered to with the IMR CH organizations. Engagement with green badge CW will be involved to ensure meeting the CSI.


Must poses Electrical & Electronics degree or relevant with minimum 3-5 years experiences in PCB Functional test or debug/validation. Familiarity and expertise in PCB functional test, set-up, troubleshooting and test processes is required. Strong Proficiency with test equipment i.e. O-scopes, DMMs, spectrum/logic analyzer, etc and basic essential shop tools. A working knowledge of schematics, SPEED BOM, test program, NI LabVIEW and/or C++ software development and application in a test programming and/or interface environment preferred Highly skilled in written and verbal communication. Possess strong project management skills, the ability to identify key milestones from project identification to project implementation, and be capable of managing milestones. Knowledge in SQL, C,,, and/or Javascript is a plus.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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