Responsible for assembly material surface analysis and identifying key mechanisms that effecting assembly process and package quality and reliability interfacial adhesion/connection issues. Conduct hands on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions/fixes to internal customers. Other duties may include failure analysis, developing innovative techniques/approaches to accelerate failure identification and mechanism understanding.
The ideal candidate needs to have the following behavioral traits:
-Strong technical background and ability for problem solving.
-Good communication, decision making and team work skills.
Inside this Business Group
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- Must be pursuing a Master or Ph.D. in Materials Science, Chemistry, Solid-state Physics, or related field.
- Handling analytical tools, XPS, TOF SIMS, SEM/EDX, FTIR, AFM understanding of structure and property of materials, material analysis and characterization.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth