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Job ID: JR0019835
Job Category: Engineering
Primary Location: Folsom, CA US
Other Locations: US, Idaho, Boise;
Job Type:

NVM Reliability R&D Engineer

Job Description

Microelectronic Quality Reliability Engineers provide project management, product, process design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, sub systems and/or completed units. Responsible for physical understanding, model prediction and enhancement of quality & reliability for advanced products, transistor, interconnect, assembly/package and testing process. Defines Si/assembly/package qualification requirement and responsible for product qualification or technology certification. Defines/develops and conducts stress tests, DFX requirements and research on individual technology components as well as integrated circuit/products. Develop cost effective production monitoring and screening schemes to ensure process is stable and products meet committed quality & reliability performance.

Job Description

In this position, you will be working as a member of the Non-Volatile Memory NVM Solutions Group's NSG's Technology Development Quality and Reliability team, helping to develop Intel's new emerging NVM technologies such as 3D XPointTM and SSD products, focusing on NVM reliability. Your responsibilities will include but not limited to: Determining reliability requirements and technology targets of components and systems to achieve company, customer and other reliability objectives. Designing and executing experiments to identify, segment, characterize and model NVM reliability mechanisms. Developing empirical and physics-based predictive reliability modeling methods and tools for reliability risk assessments. Developing new acceleration techniques, test methods and analytical tools to provide fast and effective feedback for reliability process optimization. Influencing design, process, product, test and/or system solutions in order to enable aggressive scaling of Intel's NVM technologies and exploration of novel memory cells. Developing the appropriate process- and product-qualification stress methods and criteria. You may be expected to lead small cross-functional and cross-company groups of engineers on multi-disciplinary technical projects to solve complex reliability issues- such as, during technology development and ramp to high-volume manufacturing.

The ideal candidate will have:

Ability for systematic analytical problem solving.

Demonstrated creativity and innovation in solving technical problems.

Affinity for cross -disciplinary work.

Demonstrated attention to details and quality of the work.

Demonstrated persistence and commitment to task.

Ability to communicate achieved results and to influence wide range of audiences.

Demonstrated leadership to assume the authority and advocate for new ideas.

Ability to work in a team setting with people from a wide range of backgrounds.

Ability to understand the high level picture and apply systems thinking to generate solutions.

Job Description Summary You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications: The candidate must be pursuing a MS or PhD of Science degree in Electrical Engineering, Computer Engineering, Materials Science, Physics or Information Systems. 6+ months of experience working with semiconductor device physics, materials science, probability and statistics, circuit design, semiconductor processing, and quantum physics 6+ months of experience in hands-on experimental design, execution, analysis, interpretation and synthesis. 6+ months of experience programming C or C++, PERL or Python. Preferred Qualifications: Prior Intern or Scholarship recipient. 6+ months of experience in non-volatile memories, especially product or reliability. 6+ months experience with a range of analytical lab test equipment such as Logic analyzer/oscilloscopes, semiconductor parametric analyzer CV-IV, memory testers, SEM/TEM/IREM. 6+ months experience with reliability failure statistics, physics, or failure mechanisms. 6+ months experience in one or more of the following areas: CMOS transistor level circuit design, semiconductor device physics, and memory reliability, interconnect reliability, computer or digital systems, or board level design. 6+ months experience with statistical analysis packages e.g. R, JMP or Minitab. 6+ months experience in computer programming for testing, preferably of memories and data acquisition, reduction and analysis 3+ months experience in semiconductor fabrication process, packaging assembly, and/or board system technology operation.

Other Locations
US, Idaho, Boise;

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

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