This position focus on the fault isolation, electrical testing and electrical probing technique development. As a Quality Reliability R&D Engineer you will be part of our product development labs responsible for developing and implementing new fault isolation, electrical testing and probing techniques on Intel's leading edge products for Intel's next generation Silicon, Assembly or Test Process Development.
The candidate must work in concert with Design, Debug, Device, Process Development and Quality & Reliability Engineers to ensure the techniques developed would meet Intel's yield improvement and reliability needs. The candidate must also work with equipment vendors, university labs to develop or co-develop new fault isolation, electrical testing, electrical probing, failure analysis techniques that meet the need of Intel's future technology development and production.
Your responsibilities will include but are not be limited to:
o Pathfinding, developing and implementing new fault isolation, electrical testing, electrical probing, failure analysis techniques
o Utilizing functional testers and logic analyzers to validate failing units. Evaluating the electrical, thermal and mechanical characteristics of integrated circuits, components, sub-components, and systems to determine the root cause of failure.
o Utilizing and improving fault isolation techniques such as IREM, LTM, LADA, and TIVA to locate fails quickly and reliably, and develop new fault isolation techniques that provide capabilities beyond these techniques.
o Developing new test patterns and software, designing and executing proof of concept projects to demonstrate new techniques and /or tools needed to support advanced process technology and/or product development.
o Authoring fault isolation reports and recommending corrective action to prevent reoccurrence of problems.
o Supporting new process/product transfer and startup and the automation and improvement of the fault isolation process.
o Collaborating with Quality/Reliability Engineers to assist in risk assessments.
Inside this Business Group
You must possess the below minimum qualifications to be consider for this position.
Experience can be obtained through a combination of prior education, current MS. course work, projects, research and any relevant prior job/internships.
o Master's degree Electrical Engineering, Computer Engineering, Physics or related discipline with 4+ years of relevant experience, OR Bachelor's degree Electrical Engineering, Computer Engineering, Physics or related discipline with with 6+ years of relevant experience
o Demonstrated strong knowledge of device physics, VLSI circuit analysis and materials analysis
o Minimum of 4 years experience with semiconductor fabrication, test and/or assembly packaging processing and associated materials.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth