F68 Dry Etch Senior Equipment Engineer
Dry Etch Equipment Engineer are responsible for managing the technical aspects of equipment and vendor engagement and area tool installations, relocations, retrofits activities. As well as optimizing existing tool performance. Additional responsibilities include, but are not limited to: -Completing all required safety training and ensure all work is conducted in accordance with Intel and F68 safety policies -Managing equipment vendor Continuous Improvement Projects CIP and addressing gaps -Managing performance and facilitating the development of the equipment owners -Partnering with equipment vendors and holding them accountable to projects and deliverables -Identifying and proposing area equipment projects with clear goals and objectives -Identifying gaps in tool matching and partnering with equipment owners to find and resolve root causes -Monitoring warranty status and following up on issues -Researching and identifying global area equipment BKMs and aligning local processes -Coordinating tool install schedules and following up on issues -Attending factory meetings to report on install status and following up on capacity issues -Establishing timelines and milestones for equipment installs, upgrades, and sustainment projects -Participating in applicable area, vendor, fab, and facilities meetings -Partnering with the T&D team to assist in the creating of new equipment training and documentation -Attending daily pass down meetings and communicate current/upcoming tool issues and mitigation plans -Maintaining flexibility to be on call to address shift needs -Reducing defects, improving tool availability, and finding solutions to ongoing problems -Identifying, quantifying, and qualifying cost reduction projects -Creating reports summarizing equipment availability, variability, improvements, and cost reduction projects -Supporting and maintaining HPM, LEAN and WPO activities
Inside this Business Group
-BS degree or above in an engineering related field or equivalent experience. -At least 4 years of semiconductor experience is required. - Direct tool experience on LAM/AMAT/TEL platform, Memory experiences preferred. -Advanced understanding of semiconductor equipment and processes -Proven ability to communicate and present effectively -Advanced project management and time management skills -Proven ability to troubleshoot complex problems and address root causes -Advanced data extraction, analysis, and reporting skills -Strong partnering and teamwork skills -Advanced PC skills, including Microsoft Word, PowerPoint, and Excel -Proven ability to multi-task multiple complex projects and execute based on priority -Proven ability to engage large groups and single individuals on highly technical material -Demonstrated ability to interface with team members at all levels of the organization
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.