You will use your knowledge of FIB circuit edit methods and tools, circuits, device physics, process technologies, and databases to enable debug of Intel's next generation wireless communication products.
These products range from 3rd party hard IP to die level, standalone ICs, modules, boards, and systems. They also include both internal and external manufacturing technologies. Relying on your technical judgement, you will extrapolate existing methods or invent new ones to accelerate Intel's wireless solutions into the marketplace. This role emphasizes your circuit editing engineering expertise utilizing the FEI Vectra 9800 and OptiProbe Viper FIB platforms.
In addition to your expertise as an elite silicon nano-surgeon, success will rely on your influencing skills and initiative to enable extreme collaboration with design engineering stakeholders, the ICDG lab team, other internal and external FIB circuit edit teams, and the FIB tool vendor.
Inside this Business Group
Qualifications:The ideal candidate will have a BS or MS in Electron-microscopy, Electrical Engineering, or other related engineering/science field with 5+ years of hands on FIB circuit edit experience, a proven track record of delivering on schedule, and demonstrated effective collaboration between engineering organizations.
You will use your strong problem solving skills and knowledge of FIB circuit edit methods systems to adapt to iCDG's non-standard form factors. As such, you will rely on your strong organization skills, attention to detail, and communication skills [both written and oral]. Additional qualifications or advantages include:
Successful track record of FIB Circuit Edit success Command of basic electronics and circuits consisting of resistors, capacitors, inductors, and transistors and how they relate to FIB circuit edit, technical problem solving, communications, and time management skills Broad technical and teamwork skills, knowledge and/or experience both internal and external fab processes, working knowledge of CadNav, Unix environment, and schematics. Experience using dual beam FIB for physical failure analysis is a plus
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth